Power chips are attached to exterior circuits via packaging, and their efficiency depends upon the assistance of the packaging. In high-power circumstances, power chips are normally packaged as power components. Chip affiliation describes the electric connection on the upper surface of the chip, which is usually light weight aluminum bonding cable in conventional components. ^
Standard power component bundle cross-section
Currently, commercial silicon carbide power modules still mostly make use of the product packaging modern technology of this wire-bonded conventional silicon IGBT module. They deal with troubles such as big high-frequency parasitic specifications, inadequate warmth dissipation capacity, low-temperature resistance, and not enough insulation stamina, which limit using silicon carbide semiconductors. The screen of excellent efficiency. In order to resolve these problems and totally exploit the significant potential advantages of silicon carbide chips, lots of brand-new packaging technologies and options for silicon carbide power components have actually emerged in the last few years.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have created from gold cord bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold cables to copper wires, and the driving pressure is price reduction; high-power tools have established from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost item efficiency. The better the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared with standard bonding packaging methods, Cu Clip innovation has the following benefits:
1. The link between the chip and the pins is made from copper sheets, which, to a specific degree, changes the standard cable bonding method between the chip and the pins. Therefore, an unique plan resistance value, greater existing flow, and better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully save the price of silver plating and inadequate silver plating.
3. The item look is completely constant with normal products and is mostly used in web servers, portable computers, batteries/drives, graphics cards, motors, power products, and various other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding approach is more costly and complicated, however it can achieve much better Rdson and better thermal effects.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad makes use of a Clip technique, and eviction utilizes a Cord technique. This bonding approach is a little cheaper than the all-copper bonding approach, conserving wafer location (appropriate to really little gate areas). The process is simpler than the all-copper bonding technique and can acquire better Rdson and much better thermal result.
Distributor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding 1kg copper price, please feel free to contact us and send an inquiry.
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